| 1. | 6 is the sequence of solder paste height measurements defined
锡膏厚度的测量顺序是否指定
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| 2. | Soldering pastes - part 1 : composition , technical specifications
焊剂.第1部分:成分和技术规范
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| 3. | Reflow solder paste in 2 hours as soon as possible after printing
印刷后要在2小时内回流焊膏。
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| 4. | The operator should use the solder paste quickly after it has been taken out
取出的锡膏要尽快实施印刷使用。
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| 5. | 7 is the average and range of solder paste height measurements spc controlled
锡膏厚度测量的平均值和间距spc是否受控
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| 6. | Requirements for soldering paste
焊膏要求
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| 7. | Familiar with lead - free solder paste and at least 3 years related sales experience
熟悉无铅锡膏产品及市场，具备3年以上行业销售经验。
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| 8. | To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
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| 9. | 8 are lcd ' s and ucla ' s defined for the average and range of solder paste measurements
对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限
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| 10. | On the other hand it is a wrong way of opening the cover frequently or not covering the solder paste
不要取一点用一点，频繁开盖或始终将盖子敞开着。
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